Sanford Distributing The Epoxy Source

Epocap
Potting and Encapsulating Compounds

High Performance, two part electrical potting and encapsulating compounds that provide excellent dielectric properties and penetration of voids with superior heat resistance. In addition to their excellent potting and encapsulating properties, these compounds are widely used for casting insulators, housings and terminal blocks.

• High Voltage Coils
• Transformers
• Transducers/Sensors
• Capacitor End Sealing
• Motors/stators
• Control Modules
• Submersible Pumps
• Power Supplies Potentiometers
• Cables/Harnesses
• Bridge Rectifiers
• Solenoids Switches/Connectors
• Ignition Modules
• Voltage Modules
• Ballasts/Starters
• Printed Circuit Boards
• Telecomm Devices
• Hi/Lo voltage Devices

High Performance, two part electrical potting and encapsulating compounds that provide excellent dielectric properties & penetration of voids with superior heat resistance.

In addition to their excellent potting
& encapsulating properties, these compounds are widely used for casting insulators, housings & terminal blocks.

EPOCAP 14530A/2404B

EPOCAP 14530A/2404B

Description:
EPOCAP 14530A/2404B is a filled, medium viscosity, two component system. This general purpose, room temperature cured potting and encapsulating compound exhibits good electrical properties and good thermal conductivity.

Typical Uses:
It is recommended for the potting of transformers, coils, resistors and other electrical/electronic components.

• Data Sheet (PDF)

• Pricing and Orders

• MSDS (PDF)

• See All Bulk Materials

EPOCAP 25137

EPOCAP 15144

Description:
EPOCAP 25137 is a room temperature cure, two-component, epoxy potting and encapsulating system. 25137 is UL recognized for Hazardous Locations. It is a filled system and exhibits very low shrinkage and has good chemical resistance to various fuels and alcohol/fuel mixtures.

Typical Uses:
25137 is designed for potting low to medium voltage electrical components. The A filled component should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. The best cured properties are obtained by ensuring accurate proportioning and thorough mixing. EPOCAP 25137 is excellent for producing void free castings by vacuum degassing for a few minutes after mixing and pouring.

• Data Sheet (PDF)

• Pricing and Orders

• MSDS (PDF)

• See All Bulk Materials

EPOCAP 19284

EPOCAP 19284

Description:
EPOCAP 19284 is a filled, low viscosity, two component epoxy potting and encapsulating system. This general purpose, room temperature cure system exhibits excellent impregnation of tightly wound coils and transformers.

Typical Uses:
It has good thermal conductivity, heat distortion temperature and is recommended for potting and encapsulating small coils, transformers and other electrical or electronic components.

• Data Sheet (PDF)

• Pricing and Orders

• MSDS (PDF)

• See All Bulk Materials

EPOCAP 19174

EPOCAP 19174

Description:
EPOCAP 19174 is a two component, room temperature cure electrical potting and encapsulating system with a long work life. This semi-rigid, low viscosity system has excellent thermal shock resistance and excellent impregnation properties.

Typical Uses:
It is recommended for potting tightly wound coils, transformers, time delay relays and other low or medium voltage electrical or electronic devices. The system is UL recognized for UL-94-VO flame rating at 0.250".

• Data Sheet (PDF)

• Pricing and Orders

• MSDS (PDF)

• See All Bulk Materials

EPOCAP 16505	Description: EPOCAP 16505 is a filled, two component, room temperature cure general purpose potting and encapsulating system. Typical Uses: It is recommended for potting low voltage devices such as transformers, coils, switches, time delay relays, connectors and other electrical or electronic components
• Data Sheet (PDF)	• Pricing and Orders
• MSDS (PDF)	• See All Bulk Materials

EPOSOLVE® 25036

EPOCAP 15144

Description:
EPOSOLVE® 25036 is a blend of non-chlorinated solvents designed for attacking and disintegrating fully cured and uncured thermosetting plastics such as epoxies, urethanes and polyesters. 25036 features a slow evaporation rate which lowers VOC emissions and allows for maximum usage. An ideal and efficient clean-up solvent for tools, brushes and automatic dispensing equipment. Contains no ozone depleting chemicals and is non-flammable and non-carcinogenic.

Typical Uses:
Total immersion of part to be stripped is recommended. Where possible, remove any solvent sensitive components such as O-rings and seals. Periodic brushing or scraping of the surface will aid in removing thick sections of cured material. Agitation of the solvent bath will also increase the rate of attack by EPOSOLVE® 25036.

• Data Sheet (PDF)

• Pricing and Orders

• MSDS (PDF)

• See All Bulk Materials