EPOCAP 43648-50110
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EPOCAP 43648 / EPOCURE 50110 is a versatile two–component, low-viscosity, room temperature cure encapsulation system. The cured system displays excellent physical and electrical properties at ambient temperatures. The system is recommended for low voltage, low temperature applications.
Typical Uses:
General purpose potting and encapsulating. Rotted wood filler. Adhesive applications requiring room cure and very low viscosity. Thin film coating such as table/bar topping. Concrete filler/crack repair when graded sand is added.
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Data Sheet - 43648-50110
Data Sheet - 43648-50110
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